Recent News

Always remember that business is about people. Be nice, treat others with respect, the way you would like to be treated.

Capabilities

Process Type
Soldermask/HASL
Soldermask/HASL ROHS
Full Nickel Gold Panel Plate
Selective Gold
Electroless Nickel Gold

Special Processes
Flush Circuits
Switchplates
Heatsinks
Heavy Copper, up to 6 oz.
Blind/Buried/Plugged Vias
RF Circuits
Metal Core
Hardware Installation

Materials
GF/High TG Laminates
Teflon
Duroid

Capabilities
Single Sided to 18 Layers
.004 MIL Line/Spacing
Overall Thickness .004 to .500
.008 MIL Holes
18x24 Maximum Panel
MIL-PRF-55110, IPC 6012, IPC-A-600
ITAR Registered
UL Approval to 94-VO